About the product
- Working principle: Fill the gap between heating element and the cooling device. Increase the contact area, so as to achieve the soundest effect of thermal conductivity.
- Non-Electrical Conductive, High temperature resistance, Non-toxic, Non-corrosive.
- Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components.
- Thermal Conductivity: >1.63W/m-k, Thermal Resistance: <0.249
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