About the product
- LGA1851 AND LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, thanks to even CPU contact surface
- NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors - 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
- ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
- INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard
- LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available in the technical data, in the manual and on the manufacturer\'s website. Please use the compatibility check
No reviews found!
